We offer a fully funded 4-year PhD position within the University of Twente on the development of ultra-efficient cooling technologies for advanced semiconductor packaging. The project, UltraCool, combines materials science, additive manufacturing, thermal engineering, and semiconductor integration to enable direct bonding between silicon and high-conductivity metals such as copper.

The rapid growth of AI and high-performance computing is driving heat fluxes in advanced chip packages beyond 1,000 W/cm², making thermal management one of the key bottlenecks for future electronics. This PhD project aims to address this challenge through the design of novel interlayer alloys, development of multi-material Laser Powder Bed Fusion (LPBF) processes, and integration of cooling functionality directly into package-level demonstrators.

The research will focus on the thermodynamic design of interlayer alloy feedstocks, powder production and characterization, multi-material LPBF process optimization, and the investigation of interfacial physics governing residual stress, defect formation, and thermal transport across copper–silicon interfaces. You will work with characterization methods including SEM, EBSD, XRD, thermal conductivity analysis, and thermo-mechanical testing. The project also includes the fabrication and validation of package-level cooling demonstrators for direct and indirect chip cooling applications.

You will work in a highly interdisciplinary and international environment together with academic researchers and industrial partners active in semiconductor packaging, powder production, sensing technologies, and thermal management. The project offers excellent opportunities to contribute to high-impact scientific research while developing technologies with strong industrial relevance.

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We are looking for a highly motivated, enthusiastic, and self-driven researcher who meets the following qualifications:

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