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Jobster – Delft (2600)
Postdoc position in wafer‑level packaging using 3D printing.
Department of Microelectronics at Delft University of Technology invites applications for a Postdoctoral Researcher position focused on Advanced 3D Packaging Technologies for wearable biosensors. This position forms the scientific core of Work Package 2 (WP2) within the Bio‑ChipPack project, an ambitious collaboration between TU Delft and Sensible Healthcare Systems. The project aims to redefine how microneedle‑based biosensors are packaged by developing entirely new wafer‑level additive manufacturing strategies capable of producing low‑cost, sustainable, highly reliable microneedle sensing systems.
As a Postdoctoral Researcher, you will lead research into advanced packaging technologies that bridge semiconductor devices and reusable electronics through innovative three‑dimensional structures fabricated directly at wafer level. You will also work in close collaboration with another Postdoc to co‑design the microneedle process and wafer‑level packaging process.
This position offers a unique opportunity to contribute to one of the emerging frontiers in advanced chip packaging, where microelectronics, additive manufacturing, materials science, reliability engineering, and biomedical devices converge. It also provides access to TU Delft state‑of‑the‑art cleanroom facilities (EKL and Kavli) and novel 3D printing technologies.